Citation: |
|
[1] | 孙博宇, 乔红超, 赵吉宾, 等.水导激光切割技术研究现状[J].光电工程, 2017, 44(11): 1039-1044. doi: 10.3969/j.issn.1003-501X.2017.11.001 Sun B Y, Qiao H C, Zhao J B, et al. Current status of water-jet guided laser cutting technology[J]. Opto-Electronic Engineering, 2017, 44(11): 1039-1044. doi: 10.3969/j.issn.1003-501X.2017.11.001 |
[2] | 杨立军, 孔宪俊, 王扬, 等.激光微孔加工技术及应用[J].航空制造技术, 2016(19): 32-36. Yang L J, Kong X J, Wang Y, et al. Laser micro-holes machining technology and its application[J]. Aeronautical Manufacturing Technology, 2016(19): 32-36. |
[3] | Perrottet D, Housh R, Richerzhagen B, et al. Heat damage-free laser-microjet cutting achieves highest die fracture strength[J]. Proceedings of SPIE, 2005, 5713: 285-293. doi: 10.1117/12.586710 |
[4] | 王宏智.微水导激光划片工艺原理及应用[J].电子工业专用设备, 2008, 37(3): 27-31, 49. doi: 10.3969/j.issn.1004-4507.2008.03.008 Wang H Z. The technology principle and application of water-jet-guided laser scribing[J]. Equipment For Electronic Products Manufacturing, 2008, 37(3): 27-31, 49. doi: 10.3969/j.issn.1004-4507.2008.03.008 |
[5] | 周永恒, 廖健宏, 蒙红云, 等.血管内支架的激光精细切割技术[J].应用激光, 2005, 25(3): 161-164, 154. doi: 10.3969/j.issn.1000-372X.2005.03.006 Zhou Y H, Liao J H, Meng H Y, et al. Laser micro-fabrication of endovascular stent[J]. Applied Laser, 2005, 25(3): 161-164, 154. doi: 10.3969/j.issn.1000-372X.2005.03.006 |
[6] | Richerzhagen B. Entwicklung und konstruktion eines systems zur uebertragung von laserenergie für die laserzahnbehandlung[D]. Lausanne: EPFL, 1994. |
[7] | Nilsson T, Wagner F, Housh R, et al. Scribing of GaN wafer for white LED by water-jet-guided laser[J]. Proceedings of SPIE, 2004, 5366: 200-206. doi: 10.1117/12.529012 |
[8] | 李灵.水导激光微细加工技术研究[D].哈尔滨: 哈尔滨工业大学, 2008: 1-107. Li L. Study on water-jet guided laser micromachining technology[D]. Harbin: Harbin Institute of Technology, 2008: 1-107. |
[9] | 叶瑞芳, 沈阳, 王磊, 等.新型水导引激光耦合系统研究[J].厦门大学学报(自然科学版), 2009, 48(3): 369-372. doi: 10.3321/j.issn:0438-0479.2009.03.015 Ye R F, Shen Y, Wang L, et al. Novel coupling system of water-jet guided laser[J]. Journal of Xiamen University (Natural Science), 2009, 48(3): 369-372. doi: 10.3321/j.issn:0438-0479.2009.03.015 |
[10] | 孙冬, 王军华, 韩福柱.基于离轴光学系统的水导激光耦合技术研究[J].红外与激光工程, 2018, 47(12): 1206001. Sun D, Wang J H, Han F Z. Research on coupling technology for water-jet guided laser machining based on off-axis optical system[J]. Infrared and Laser Engineering, 2018, 47(12): 1206001. |
[11] | Adelmann B, Ngo C, Hellmann R. High aspect ratio cutting of metals using water jet guided laser[J]. The International Journal of Advanced Manufacturing Technology, 2015, 80(9-12): 2053-2060. doi: 10.1007/s00170-015-7161-8 |
[12] | Porter J A, Louhisalmi Y A, Karjalainen J A, et al. Cutting thin sheet metal with a water jet guided laser using various cutting distances, feed speeds and angles of incidence[J]. The International Journal of Advanced Manufacturing Technology, 2007, 33(9-10): 961-967. doi: 10.1007/s00170-006-0521-7 |
[13] | Couty P, Wagner F R, Hoffmann P W. Laser coupling with a multimode water-jet waveguide[J]. Optical Engineering, 2005, 44(6): 068001. doi: 10.1117/1.1928280 |
[14] | 孙冬, 王军华, 韩福柱.单晶硅水导/水辅助激光切割加工对比研究[J].应用激光, 2016, 36(6): 723-727. Sun D, Wang J H, Han F Z. Contrastive study of water jet guided laser and water jet assisted laser cutting of Monocrystalline silicon[J]. Applied Laser, 2016, 36(6): 723-727. |
Overview: The laser processing technology of metal material is developing with a trend of low surface roughness, small heat-affected zone and high depth-diameter ratio. Recently, a kind of water-conducting laser processing technology has been developed based on water-jet coupling technology. In this technology, the laser is completely reflected at the interface between water jet and air. The flushing and cooling effect of water jet improve the surface roughness and decrease the size of heat-affected zone. The water jet in steady state which can be used to conduct laser and remove material has high depth-diameter ratio. And this technology also makes laser processing of structures with high depth-diameter ratio become possible.
To reveal the material removing feature of water-conducting laser processing technology, a set of water-conducing laser processing equipment is developed. This equipment consists of coupling and observation system, motion control system and water supply system. The experiments of water-conducting laser processing for C276 alloy and SAE 1070 alloy are carried out. The laser used in experiments has a wavelength of 532 nm. The diameter of water jet nozzle hole is 100 μm and the diameter of water jet is about 83 μm. Holes and groves are machined on both materials and the morphology of machining zone is measured by Leica DVM6 digital microscope.
In the blind hole machining experiment, the edge of hole is regular and smooth. And the diameter of blind hole is larger than the diameter of water jet. The reason is that the side walls of blind hole also absorb the energy of laser in machining process. And the diameter of blind holes machined for longer time is also bigger. But there is molten sediment around the blind hole for the reason that the drainage condition in blind hole machining is not good. The water connot flush the molten materials away efficiently. To improve the drainage condition of water and eliminate the molten sediment, the rotary cutting method can be used.
In the grove machining experiment, the edges of grooves are straight and without burrs, and there is no heat-affected zone in both materials. The section shape of grove is nearly a fillet triangle, and the reason is that the central part of water jet has higher energy density. In the machining of grove, no molten sediment is observed because the flow of water is unimpeded and the water brings molten sediment away efficiently.
The material removing feature of water-conducting laser processing technology is revealed and the results of machining experiments show that water-conducting laser processing technology on metal precision machining is practical and has important application value.
Basic principle of water-conducting laser processing technology
Diagram of water-conducting laser processing system
The figure of nozzle hole. (a) Damaged nozzle hole; (b) Undamaged nozzle hole
Different structures machined by water-conducting laser processing system on C276 alloy. (a) Hole; (b) Groove; (c) Square groove
Three-dimensional shape and cross-section shape of groove structure machined on C276 alloy.
Sketch of rotary drilling method
Different structures machined by water-conducting laser processing system on SAE1070 alloy. (a) Hole; (b) Groove
Three-dimensional shape and cross-section shape of groove structure machined on SAE1070 alloy.