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Overview: Microstructure optical elements are playing an increasingly important role in optical systems, and the corresponding application needs promote the research of microstructural processing technology. The main processing methods of optical microstructures are optical lithography, electron beam direct writing and focused ion beam etching. These methods all have shortcomings in universality and efficiency of processing materials. Especially for the thin film optical microstructures with gradual profile, when the refractive index of the optical materials changes along the normal direction of the structure, the processing method mentioned above is more complicated and difficult to guarantee the accuracy of the preparation. Single-point diamond flying tool turning has attracted wide attention due to its advantages of high efficiency, low cost and high precision. Considering the linkage of machine tool axis, we use end face flying cut by four axis linkage. The principle of flying cutter turning micro-pyramid structure is profiling, and the shape of the cutter is carved on the surface of the workpiece. This ultra-precision turning method requires strict processing conditions, and any small errors introduced by minor changes will affect the final turning results. For example, the repeated positioning errors of machine tools and the vibration interference in the process of machining will affect the turning surface quality. Especially in the processing of micro-structure arrays with micron size, the ultimate impact is the deviation of tool center, which makes unexpected errors on the turning surface. We study the micro-structure size error caused by tool center deviation. By analyzing the influence of tool center offset on the turning results of micro-V groove in the process of cyclic machining, the reason of secondary groove in V groove turning is obtained, and the method of restraining secondary groove is put forward, that is, controlling the depth of single turning is greater than the error of tool center offset. According to the processing conditions and experiments, the maximum deviation error of the tool center can be obtained, which is the minimum turning depth of the fly cutting when turning the micro-structure. To ensure that the turning depth is greater than this value, the generation of sub-grooves can be restrained. The validity of the theoretical analysis is verified by the experiment of turning micro-V groove and micro-pyramid structure with fly cutting. When the single turning depth is less than the deviation error of tool center, the turning results of micro-V groove and micro-pyramid structure are the same as the theoretical analysis.
The method of fying cutting
Principle of micro pyramid array turning with flying cutter by copying method
Characteristic dimension diagram of V-groove
Effect of tool center offset on V-groove cutting effect
Sketch diagram of tool center offset and cutting result
Machining result of V-groove in different cutting depth
Machining result of different cutting depth for micro pyramid structure