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Lu B H, Lan H B, Liu H Z. Additive manufacturing frontier: 3D printing electronics. Opto-Electron Adv 1, 170004 (2018). doi: 10.29026/oea.2018.170004
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Abstract
3D printing is disrupting the design and manufacture of electronic products. 3D printing electronics offers great potential to build complex object with multiple functionalities. Particularly, it has shown the unique ability to make embedded electronics, 3D structural electronics, conformal electronics, stretchable electronics, etc. 3D printing electronics has been considered as the next frontier in additive manufacturing and printed electronics. Over the past five years, a large number of studies and efforts regarding 3D printing electronics have been carried out by both academia and industries. In this paper, a comprehensive review of recent advances and significant achievements in 3D printing electronics is provided. Furthermore, the prospects, challenges and trends of 3D printing electronics are discussed. Finally, some promising solutions for producing electronics with 3D printing are presented. -
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References
[1] Gibson I, Rosen D W, Stucker B. Additive manufacturing technologies (Springer, New York, 2010). [2] Derby B. Printing and prototyping of tissues and scaffolds. Science 338, 921–926 (2012). doi: 10.1126/science.1226340 [3] Lewis J A, Ahn B Y. Device fabrication: Three-dimensional printed electronics. Nature 518, 42–43 (2015). doi: 10.1038/518042a [4] Kong Y L, Tamargo I A, Kim H, Johnson B N, Gupta M K et al. 3D printed quantum dot light-emitting diodes. Nano Lett 14, 7017–7023 (2014). doi: 10.1021/nl5033292 [5] Lan H. Active mixing nozzle for multimaterial and multiscale three-dimensional printing.J Micro Nano-Manuf 5, 040904 (2017). doi: 10.1115/1.4037831 [6] Zheng X, Smith W, Jackson J, Moran B, Cui H et al. Multiscale metallic metamaterials. Nature Mater 15, 1100–1106 (2016). doi: 10.1038/nmat4694 [7] Vaezi M, Seitz H, Yang S. A review on 3D micro-additive manufacturing technologies. Int J Adv Manuf Technol 67, 1721–1754 (2013). doi: 10.1007/s00170-012-4605-2 [8] Tian X Y, Yin L X, Li D C. Current situation and trend of fabrication technologies for three-dimensional metamaterials. Opto-Electron Eng 44, 69–76 (2017). [9] Espalin D, Muse D. W, MacDonald E, Wicker R B. 3D Printing multifunctionality: structures with electronics. Int J Adv Manuf Technol 72, 963–978 (2014). doi: 10.1007/s00170-014-5717-7 [10] Lu Y, Vatani M, Choi J W. Direct-write/cure conductive polymer nanocomposites for 3D structural electronics. J Mech Sci Technol 27, 2929–2934 (2013). doi: 10.1007/s12206-013-0805-4 [11] Muth J T, Vogt D M, Truby R L, Mengüç Y, Kolesky D B et al. Embedded 3D printing of strain sensors within highly stretchable elastomers. Adv Mater26, 6307–6312 (2014). doi: 10.1002/adma.201400334 [12] Wu S Y, Yang C, Hsu W, Lin L. 3D-printed microelectronics for integrated circuitry and passive wireless sensors. Microsys Nanoeng 1: 15013 (2015). doi: 10.1038/micronano.2015.13 [13] Sun K, Wei T S, Ahn B Y, Seo J Y, Dillon S J et al. 3D Printing of interdigitated Li-Ion microbattery architectures.Adv Mater 25, 4539–4543 (2013). doi: 10.1002/adma.201301036 [14] Lehmhus D, Aumund-Kopp C, Petzoldt F, Godlinskic D, Haberkorn A et al. Customized smartness: a survey on links between additive manufacturing and sensor integration.Procedia Tech 26: 284–301 (2016). doi: 10.1016/j.protcy.2016.08.038 [15] Ladd C, So J H, Muth J, Dickey M D. 3D printing of free standing liquid metal microstructures.Adv Mater 25, 5081–5085 (2013). doi: 10.1002/adma.201301400 [16] Lifton V A, Lifton G, Simon S. Options for additive rapid prototyping methods (3D printing) in MEMS technology. Rapid Prototyping J 20, 403–412 (2014). doi: 10.1108/RPJ-04-2013-0038 [17] MacDonald E, Wicker R. Multiprocess 3D printing for increasing component functionality. Science 353: aaf2093 (2016). doi: 10.1126/science.aaf2093 [18] Wicker R B, MacDonald E W. Multi-material, multi-technology stereolithography. Virtual Phys Prototyping 7, 181–194 (2012). doi: 10.1080/17452759.2012.721119 [19] Kief C J, Aarestad J, Macdonald E, Shemelya C, Roberson D A et al. Printing multi-functionality: additive manufacturing for CubeSats. In AIAA SPACE 2014 Conference and Exposition, AIAA SPACE Forum 4193 (AIAA, 2014); https://arc.aiaa.org/doi/abs/10.2514/6.2014-4193 [20] Liang M, Shemelya C, MacDonald E, Wicker R, Xin H. 3D printed microwave patch antenna via fused deposition method and ultrasonic wire mesh embedding technique. IEEE Antennas Wireless Propag Lett 14, 1346–1349 (2015). doi: 10.1109/LAWP.2015.2405054 [21] Shemelya C, Cedillos F, Aguilera E, Espalin D, Muse D et al. Encapsulated copper wire and copper mesh capacitive sensing for 3-D printing applications. IEEE Sens J 15, 1280–1286 (2015). doi: 10.1109/JSEN.2014.2356973 [22] Ready S, Whiting G, Ng T N. Multi-material 3D printing. In NIP & Digital Fabrication Conference, 2014 International Conference on Digital Printing Technologies 120–123 (2014). [23] Pa P, Larimore Z, Parsons P, Mirotznik M. Multi-material additive manufacturing of embedded low-profile antennas. Electron Lett 51, 1561–1562 (2015). doi: 10.1049/el.2015.2186 [24] Lopes A J, MacDonald E, Wicker R B. Integrating stereolithography and direct print technologies for 3D structural electronics fabrication. Rapid Prototyping J 18, 129–143 (2012). doi: 10.1108/13552541211212113 [25] Jang S H, Oh S T, Lee I H, Kim H C, Cho H Y. 3-Dimensional circuit device fabrication process using stereolithography and direct writing. Int J Precis Eng Man 16, 1361–1367(2015). doi: 10.1007/s12541-015-0179-x [26] Bijadi S. Feasibility of additive manufacturing method for developing stretchable and flexible embedded circuits (University of Minnesota, Minneapolis, USA, 2014). [27] Vatani M, Lu Y, Engeberg E D, Choi J W. Combined 3D printing technologies and material for fabrication of tactile sensors. Int J Precis Eng Man 16, 1375–1383 (2015). doi: 10.1007/s12541-015-0181-3 [28] Hedges M. 3D Printed Electronics via Aerosol Jet (Neotech, 2014). [29] Optomec. https://www.optomec.com (2017). [30] Cai F, Pavlidis S, Papapolymerou J, Chang Y H, Wang K et al. Aerosol jet printing for 3-D multilayer passive microwave circuitry. In IEEE European Microwave Conference (IEEE, 2014); http://do.org/10.1109/EuMC.2014.6986483 [31] Runge D. 3D-Printing und gedruckte Elektronik für die Medizintechnik (University of Applied Science Bremerhaven, Bremen Area, Germany, 2016). [32] Voxel8. https://www.voxel8.com (2017). [33] Dickey M. Liquid metals for soft and stretchable electronics. In Stretchable Bioelectronics for Medical Devices and Systems. Microsystems and Nanosystems (Springer, Cham, 2016);https://doi.org/10.1007/978-3-319-28694-5_1 [34] Rahman M T, Rahimi A, Gupta S, Panata R. Microscale additive manufacturing and modeling of interdigitated capacitive touch sensors. Sensor Actuat A-Phys 248, 94–103 (2016). doi: 10.1016/j.sna.2016.07.014 [35] Donnell J, Kim M, Yoon H. A review on electromechanical devices fabricated by additive manufacturing. ASME J Manuf Sci E-T 139, 010801 (2017). [36] Thompson B, Yoon H S. Aerosol-printed strain sensor using PEDOT: PSS. IEEE Sens J13, 4256–4263 (2013). doi: 10.1109/JSEN.2013.2264482 [37] Madden K E, Deshpande A D. On integration of additive manufacturing during the design and development of a rehabilitation robot: a case study. ASME J Mech Des137, 111417 (2015). doi: 10.1115/1.4031123 -
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Lu B H, Lan H B, Liu H Z. Additive manufacturing frontier: 3D printing electronics. Opto-Electron Adv 1, 170004 (2018). doi: 10.29026/oea.2018.170004
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Figure 1.
(a, b) Photograph of the multi3D system. (c) Schematic of a fabrication example9, 14
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Figure 2.
(a) Process flow of the multi3D system. (b) Fabricated parts9, 14
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Figure 3.
Fabrication procedure of fully encapsulated capacitive sensor with 3D printing. (a) Polycarbonate (PC) substrate with recesses designed for all electronic components. (b) Components arranged in in the PC substrate. (c) Electrical components with corresponding embedded wiring. (d) Completed capacitive sensor with fully embedded wiring, diodes, LEDs, resistors, and a microcontroller21
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Figure 4.
(a) Printed wireless pressure and temperature sensor within a shoe's insole. (b) Pressure and temperature data obtained through wireless communication from the printed insole22
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Figure 5.
Fabrication process of 3D "smart cap" with an embedded inductor–a wireless passive sensor12. (a) 3D fabrication process with embedded and electrically conductive structures. (b) 3D microelectronics components, including parallel-plate capacitors, solenoid-type inductors, and meandering-shape resistors. (c) A 3D LC tank, which is formed by combining a solenoid-type inductor and a parallel-plate capacitor. (d) A wireless passive sensor demonstration of a "smart cap", containing the 3D-printed LC-resonant circuit. (e) A smart cap with a half-gallon milk package, and the cross-sectional schematic diagram. (f) Sensing principle with the equivalent circuit diagram
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Figure 6.
(a) Schematic of the hybrid SL/DP system. (b~d) Fabricated 3D 555 timer circuits packaged within SL substrates24
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Figure 7.
The hybrid 3D printing process and fabricated 3D structural electronics10. (a) Bottom insulating structure. (b) "U" shape wire. (c) Top insulating layer. (d) Wires on top surface. (e) PμSL of the bottom insulating structure. (f) DWC of the "U" shape wire. (g) PμSL of the top insulating structure. (h) DWC of wires on the top surface. (i) Fabricated 3D structural electronics with embedded wires
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Figure 8.
Examples of printed 3D structural electronics18. (a) A gaming die which includes a microcontroller and accelerometer. (b, c) A magnetometer system with microprocessor and orthogonal Hall Effect sensors
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Figure 9.
Schematic illustration of the embedded 3D printing (e-3DP) process and printed stretchable electronics11. (a) Schematic illustration of the e-3DP process. (b) Photograph of a glove with embedded strain sensors produced by e-3DP. (c) Photograph of a three-layer strain and pressure sensor in the stretched state
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Figure 10.
Fabricated stretchable tactile sensor using integrated PSL and DP processes27. (a) An example (partial sphere) of 3D structure built in the PSL system. (b) Printed sensing elements using the DP process on the insulating layers built in the PSL system. (c) Final sensor with two sensing layers. (d) Deformed sensor
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Figure 11.
3D printed electronics using Aerosol Jet printing from Optomec28-30. (a) 3D MID demonstrator. (b) 3D MID with integrated sensor. (c) Printed conformal electronics (curve). (d) Printed conformal electronics (dome). (e) Printed conformal electronics (dome). (f) Sub-mm length scale, custom made 3D metal-dielectric
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Figure 12.
Leg prosthesis part produced by FDM and Aerosol Jet printing31
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Figure 13.
Voxel8 and some printed products32. (a, b) Photograph of Voxel8 3D printer. (c) Printed unmanned aerial vehicle. (d) Printed antenna (dome). (e) Printed wearable device
