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Overview: Silicon-based PIN photodetectors have become one of the most widely used detectors in the field of optoelectronics due to their high photoresponse, fast response speed, and stable performance. Since silicon is an indirect band gap material and cannot absorb light waves with a wavelength greater than 1100 nm, silicon PIN photodetectors are mostly used to detect visible light and near-infrared light.
According to the direction of the PIN junction inside the device, silicon PIN detectors are mainly divided into lateral side incident type and vertical surface incident type. Although the vertical incidence silicon PIN photodetector has a larger light receiving area than the horizontal PIN detector, the band gap of silicon limits its ability to absorb near-infrared light. In order to improve the response speed of traditional silicon PIN photodetectors with vertical incidence, the high resistance intrinsic region is usually narrowed to minimize the drift time of photo-generated carriers. However, a too thin I region will cause the incident long-wave photons to be emitted from the device without completely converting them into photo-generated carriers, which reduces the quantum efficiency and photoresponsivity of the device. Therefore, the vertical incidence silicon PIN photodetector faces the contradiction between high quantum efficiency and high response speed.
This paper reports an all-silicon PIN photodetector based on the black silicon microstructure. Femtosecond laser technology is used to set a layer of the black silicon microstructure on the back of the traditional PIN detector to form supersaturated doping on the surface of the silicon material. The photons with energy less than the band gap can also be absorbed by the modified silicon material, which improves the absorption rate of visible light and near-infrared light. And this black silicon microstructure layer also forms a light reflector with the back aluminum electrode, which can effectively reflect the unabsorbed near-infrared light back to the substrate and increase the incident light in the depletion zone by changing the reflection path of the incident light. The effective optical path length makes more photo-generated carriers generated in the depletion region, which improves the light responsivity and quantum efficiency of the device in the near-infrared band.
By adding a black silicon microstructure layer on the basis of the traditional silicon PIN photodetector structure, the response characteristics of the detector in the near-infrared band are improved without affecting the response speed. A method is proposed to solve the contradiction between the quantum efficiency and the response speed in the vertical structure of the PIN photodetector. It has been tested and verified that the device has a responsivity of 0.55 A/W at 940 nm, which is about 10% higher than the traditional PIN detector. The quantum efficiency can reach 80%.
Cross-sectional schematic diagram of an all-silicon PIN photodetector based on the black silicon microstructure
Scanning electron microscope image of the black silicon microstructure layer
Comparison curves of spectral response and quantum efficiency between silicon PIN photodetector GD3252Y based on the black silicon microstructure and the conventional PIN photodetector
Capacitance characteristic curve of the all-silicon PIN photodetector based on black silicon microstructure